+44 (0)24 7671 8970
More publications     •     Advertise with us     •     Contact us
*/
{megaLeaderboard}
{normalLeaderboard}
News Article

Sony Semiconductor Israel Redefines IoT Connectivity Platform

News

Sony Semiconductor Israel (Sony), a provider of cellular IoT chipsets, has announced the launch of the ALT1350 for the global market. The ALT1350 is the world’s first cellular LTE-M/NB-IoT solution to enable additional LPWA communication protocols, as well as satellite connectivity (NTN), in a single chipset, opening the door to further innovation in the connected world.

The ALT1350 by Sony is the most advanced cellular IoT solution on the market, with an architecture that resolves IoT service providers’ power consumption concerns. Its optimized standby mode (eDRX) reduces power consumption by 80% when compared to the current generation and by 85% when using it to send short messages. Overall improvements in the system’s power consumption will enable 4 times longer battery life for a typical device, enabling additional functionalities and use cases with smaller batteries.

The ALT1350’s sub-GHz and 2.4GHz integrated transceiver enables hybrid connectivity for smart meters, smart cities, trackers, and other devices. This enhances coverage, reduces costs, and further decreases power consumption utilizing IEEE 802.15.4-based protocols, such as Wi-Sun, U-Bus Air, and wM-Bus, in additional point-to-point and mesh technologies.

ALT1350 incorporates a sensor hub to collect data from the sensors while maintaining ultra-low power consumption. It also provides cellular & Wi-Fi-based positioning and is tightly integrated to provide power-optimized concurrent LTE and GNSS to accommodate various tracking applications, which can be demanding, with a single chip.

“The market demand for this multiprotocol, ultra-low power IoT chipset is intensifying, and Sony's ALT1350 chipset meets that demand,” said Nohik Semel, CEO at Sony Semiconductor Israel. “This is the game changer we’ve been waiting for, which will enable IoT deployments, utilizing universal connectivity on edge processing and multiple location technologies”

The chipset is designed to support the wide-ranging market needs of utilities, vehicles, tracking devices, smart cities, connected health, and other verticals. Device manufacturers across all verticals will take advantage of its low power consumption, long-lasting battery life, mature Release 15 LTE-M/NB-IoT software stack, and future compatibility with 3GPP release 17 All these guarantee longevity and ensure the ALT1350 will operate with 5G networks. It contains an additional LPWA radio transceiver with targeting operation in <1GHz and 2.4 ISM bands for universal connectivity options.

The chipset provides advanced on-the-edge low-power processing capabilities, ranging from data collection, low-power AI/ML processing of the data, and MCU to enable IoT applications on the chip. Currently, the device is sampling to lead customers and will become commercially available during 2023. The ALT1350 also includes a secure element for application usage and integrated SIM (iSIM), designed for PP-0117 to meet GSMA requirements

The all-seeing eyes of Industry 4.0
Imec demonstrates co-integration of high-quality SiN waveguide technology with silicon photonics platform
Fraunhofer IPMS presents latest photonic technologies
CEA-Leti Will Highlight Progress on Key Augmented Reality Building Blocks
DigiLens announces partnership with Omnivision
Alif Semiconductor, Bosch Sensortec, and Edge Impulse deliver extended sensor functions
All-CMOS pressure sensor sets new performance standard in wearable and mobile applications
ANELLO Photonics Announce Silicon Photonics Optical Gyroscope
Renesas Will Support Matter on All Future Wi-Fi, BLE and Thread Products
Using sensor technology to protect vulnerable regions
Sony Semiconductor Israel Redefines IoT Connectivity Platform
EnOcean announce agreement with Parabellum Acquisition
Sensor Sales Stay Strong Due to Big ASP Rise
Renesas Unveils First Family of Automotive Radar Transceivers
Melexis has the solution for EV battery current sensing
Sharper Shape enters into agreement to acquire Ai4 Technologies
Infineon introduces new sensor family for automotive applications
Molex Expands North American Manufacturing Capabilities
Imec demonstrates flat-panel-display-compatible pMUT technology
InferSens to Introduce Ultra-Low-Power Edge DL Sensor Technology
Smart sensors for smarter industrial robotics
POLYN Technology Accepted into Silicon Catalyst Incubator Program
Enriching MEMS sensor use cases in CE and IoT
ABB partners with Samotics to expand its condition monitoring services
How LiDAR brings Spatial Intelligence to Airports
Tattile Selects Hailo to Empower its Next-Gen Smart LPR Cameras for ITS
Sivers Photonics receives 1 MUSD follow-up order
Optimized LoRa sensor network power solutions can lower IoT Opex
TERAKI selects Infineon for ML-based radar detection software
MantiSpectra and Vestel cooperate to make home appliances smarter
SICK and Aeva to Bring 4D LiDAR to Industrial Sensing Applications
OMNIVISION Announces World’s Smallest Global Shutter Image Sensor
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Sensor Solutions Magazine, the Sensor Solutions Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in: