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Teledyne E2v Expands Its Emerald Image Sensor Family With New Compact Global Shutter 3.2MP Sensor

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New Emerald 3.2M is designed in an ultra-compact format

Teledyne e2v, a Teledyne Technologies company and global innovator of imaging solutions, announces its new Emerald 3.2 Megapixel CMOS image sensor, specially designed to tackle the challenges of emerging applications such as security, drones and embedded vision, as well as traditional machine vision.

With its 2.8 µm global shutter pixel and innovative design, the new 3.2M sensor shares all of the characteristics of the Emerald sensor series: superior low-noise performance, compact format, easy integration and a wide range of embedded features.

The sensor has been designed in an ultra-compact light package format with low power to address the challenge of optimizing SWaP-C (Size, Weight, Power and Cost). The device also features a MIPI interface, that provides a direct connection to low-cost MIPI ISPs and a central optical center that helps to minimize the camera size. Its small pixel enables the sensor to fit within compact and cost-effective S-mount optics. In addition, Emerald 3.2M is pin-to-pin and optically compatible with Emerald 2M and Emerald 5M, so that multiple resolutions are supported from one single design, saving cost.

The Emerald 3.2M sensor is available in two different package options (ceramic LGA or organic fan-out BGA) to either optimize size and cost or prioritize robustness in harsh conditions. It offers versatility in terms of Chief Ray Angle (CRA) as well to ensure a perfect match with different kinds of optics.

This new sensor completes Teledyne e2v's Emerald product portfolio which includes sensors in resolutions from 2 to 67 Megapixels.

AngelTech Online Summit - Tuesday 19th May

The health and well-being of AngelTech speakers, partners, employees and the overall community is our top priority. Due to the growing concern around the coronavirus (COVID-19), and in alignment with the best practices laid out by the CDC, WHO and other relevant entities, AngelTech decided to postpone the live Brussels event to 16th - 18th November 2020.

In the interim, we believe it is still important to connect the community and we want to do this via an online summit, taking place live on Tuesday May 19th at 12:00 GMT and content available for 12 months on demand. This will not replace the live event (we believe live face to face interaction, learning and networking can never be fully replaced by a virtual summit), it will supplement the event, add value for key players and bring the community together – digitally.

The event will involve 4 breakout sessions for CS International, PIC International, Sensors International and PIC Pilot Lines.

Key elements of the online summit:

  • Covering key topics of the industries
  • Live 3 hour online summit
  • 10 minute presentations – learn from experts in the industry
  • Recorded product demos
  • Live audience questions
  • Enhanced discussion and audience interaction
  • Video panel sessions
  • Sponsors digital booth (intro video, company content, lead generator, facilitate one on one video meetings with attendees)
  • Live private video meetings between two or more attendees
  • After the live event, monthly keynotes to drive traffic to the event 24/7, 365

Innovation is in AngelTech’s DNA and we are leveraging this strength to bring you an immersive and inspiring online event without the risk of travel during this uncertain period.

Register to attend
Angel Tech Online Summit
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