Info
Info
News Article

Plan Optik Driving Connectivity To The Next Level

News

Plan Optik AG, manufacturer of customized wafers from glass, quartz or glass-silicon compound materials launched its new Cu-Interposer technology at SEMICON Europa 2019.

The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient communication with high transmission rates in the 3D chip stack or 3D system package. At present, organic interposers are predominantly used for these technologies. Organic interposers can be produced inexpensively, but are no match for the modern and increasing demands on 3D integration and high transfer rates. Through Glass Via Wafers (TGVs) offer a cost-effective alternative to the costly silicon interposer technology. TGV interposers are a promising technology for three-dimensional and high-density hybrid integration. For high-frequency applications and optoelectronic components, insulation layers are integrated and therefore not required compared to silicon technology of IC chips.

But: There is no established solution to produce glass interposers at wafer level, which provides all the required properties for high-frequency applications. For this reason, Plan Optik has developed a new technology to produce interposers with an applied copper layer, which is particularly suitable for high-frequency applications.

Next Generation Interposer

As a first step, Plan Optik will be able to offer Interposers as drilled glass wafers with a copper layer. Those Interposer wafers will be available in sizes up to 300 mm with hole diameters down to 100 µm (depending on wafer thickness). At present, customized Redistribution Layers (RDL) can be integrated on wafer sizes up to 8”. The wafer thickness ranges from 200 µm up to 1 mm. Plan Optik's Cu-Interposer can be produced as a wafer, as panels or as boards depending on customer needs. With a minimum hole distance equal to via diameter and a Cu-layer thickness starting from 1 µm Cu-Interposer are perfectly suitable for high-frequency applications like for example 5G broadband transmission, radar and imaging sensors, biosensors or beam steering networks.

New Wireless Torque Technology
Landis+Gyr Awarded Major Smart Water Contract By South East Water
Webinar: Next Generation Optical Spectrum Analyzer
Smart Eye And OmniVision Announce End-to-End Interior Sensing Solution
BAE Systems Unveils Ultra Low-Light Image Sensor
Paragraf Introduces A Graphene Hall Sensor
Toshiba Expands Scope Of Its Solid-State LiDAR Solution To Address Transportation Infrastructure Monitoring
SiLC Rolls Out Chip-Integrated FMCW LiDAR Sensor
Continental And Iteris Collaborate To Explore Intelligent Infrastructure Technology
Brewer Science’s Newly Launched Smart Devices Will Be Displayed At CES
Take It To The Limit With HBK’s New Force Sensor
New Investment In Light-powered Biosensor Accelerates The Availability Of High Quality – Low Cost Tests
Melexis Announces Latest Triaxis Position Sensor Together With New PCB-less Packages
The All-round Smart Proximity Sensor Chip
Faraday Future Selects Velodyne As Exclusive Lidar Supplier For Flagship FF 91
Lumentum Expands VCSEL Array Range
Scientists Make Novel Thermal Sensor
NTU Singapore Launches Quantum Science And Engineering Centre
RoboSense Teams Up With Webasto On Smart Roof Module With Integrated MEMS LiDAR
Brewer Science Demonstrates Smart Devices & Printed Electronics Capabilities
OmniVision Announces Industry’s First 8 Megapixel Medical-Grade Image Sensors For Single-Use And Reusable Endoscopes
HELLA Brings Latest Passenger Car 77GHz Radar Technology Into Series Production
World-leading Pharmaceutical Developer Turns To TorqSense
Plus Selects Aeva 4D LiDAR For The Volume Production Of Autonomous Trucks
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Sensor Solutions Magazine, the Sensor Solutions Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
Live Event